Assignee
LEE KEUN-HYUK
KR·2 granted patents·36 citations·filing 2008–2008
Top patents by PatentIndex Score
2 records- 0190US8258622B2Power device package and semiconductor package mold for fabricating the sameLEE KEUN-HYUK·Filed 2008·Granted Sep 4, 2012·23 cites·25 claims
- 0283US8125080B2Semiconductor power module packages with simplified structure and methods of fabricating the sameLEE KEUN-HYUK·Filed 2008·Granted Feb 28, 2012·13 cites·27 claims
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