Assignee

LEE MENG-HAN

TW2 patents

Top patents by PatentIndex Score

US8450624B2May 28, 2013

Supporting substrate and method for fabricating the same

LEE MENG-HAN0 citations36

US8058567B2Nov 15, 2011

High density package substrate and method for fabricating the same

LEE MENG-HAN0 citations33