Assignee
LEE MING HSUN
TW·2 granted patents·4 pending applications·12 citations·filing 2007–2017
Top patents by PatentIndex Score
6 records- 0176US8097495B2Die package with asymmetric leadframe connectionLEE MING HSUN·Filed 2008·Granted Jan 17, 2012·7 cites·15 claims
- 0270US9909305B2Composite wall assemblyLEE MING HSUN·Filed 2017·Granted Mar 6, 2018·5 cites·7 claims
- 0341US2009004783A1Method of package stacking using unbalanced molded tsopLEE MING HSUN·Filed 2007·Application pending·0 cites
- 0441US2009004774A1Method of multi-chip packaging in a tsop packageLEE MING HSUN·Filed 2007·Application pending·0 cites
- 0541US2009001533A1Multi-chip packaging in a tsop packageLEE MING HSUN·Filed 2007·Application pending·0 cites
- 0641US2009001529A1Package stacking using unbalanced molded tsopLEE MING HSUN·Filed 2007·Application pending·0 cites
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