Assignee
LEE SANG-DO
KR·2 granted patents·2 pending applications·16 citations·filing 2002–2011
Top patents by PatentIndex Score
4 records- 0184US8779422B2Semiconductor device with buried bit line and method for fabricating the sameLEE SANG-DO·Filed 2011·Granted Jul 15, 2014·9 cites·6 claims
- 0254US8058735B2Wafer-level chip scale package having stud bump and method for fabricating the sameLEE SANG-DO·Filed 2002·Granted Nov 15, 2011·7 cites·29 claims
- 0350US2008301979A1InsoleLEE SANG-DO·Filed 2006·Application pending·0 cites
- 0434US2012153380A1Method for fabricating semiconductor deviceLEE SANG-DO·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →