Assignee
LEE SE-YOUNG
KR·3 granted patents·1 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0156US8263454B2Embedded semiconductor device including planarization resistance patterns and method of manufacturing the sameLEE SE-YOUNG·Filed 2010·Granted Sep 11, 2012·1 cites·10 claims
- 0248US8252630B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2008·Granted Aug 28, 2012·0 cites·16 claims
- 0346US8530275B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2012·Granted Sep 10, 2013·0 cites·3 claims
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