Assignee

LEE SEOK HYUN

KR·2 granted patents·2 citations·filing 2016–2021

Technology mixB26D1 H01L1 H10P1 H10W1

Top patents by PatentIndex Score

2 records

0170US9929022B2Semiconductor chip package and method of manufacturing the sameLEE SEOK HYUN·Filed 2016·Granted Mar 27, 2018·2 cites·20 claims
0250US12390948B2Device for cutting diagnostic reagent paper into stripLEE SEOK HYUN·Filed 2021·Granted Aug 19, 2025·0 cites·8 claims

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