Assignee
LEE SINJAE
KR·2 granted patents·16 citations·filing 2009–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0186US8531012B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVLEE SINJAE·Filed 2009·Granted Sep 10, 2013·13 cites·22 claims
- 0269US8569870B1Integrated circuit packaging system with shielding spacer and method of manufacture thereofLEE SINJAE·Filed 2012·Granted Oct 29, 2013·3 cites·10 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →