Assignee
LEE WOONG SUN
KR·3 granted patents·3 pending applications·4 citations·filing 2008–2012
Top patents by PatentIndex Score
6 records- 0174US8441116B2Semiconductor package having substrate for high speed semiconductor packageLEE WOONG SUN·Filed 2012·Granted May 14, 2013·4 cites·17 claims
- 0251US8129627B2Circuit board having semiconductor chipLEE WOONG SUN·Filed 2009·Granted Mar 6, 2012·0 cites·20 claims
- 0348US8445322B2Method of fabricating semiconductor packageLEE WOONG SUN·Filed 2011·Granted May 21, 2013·0 cites·20 claims
- 0447US2009174073A1Substrate for semiconductor package having coating film and method for manufacturing the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 0547US2009152708A1Substrate for high speed semiconductor package and semiconductor package having the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 0641US2010142118A1Copper-clad laminate with capacitor, printed circuit board having the same, and semiconductor package having the printed circuit boardLEE WOONG SUN·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LEE WOONG SUN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →