Assignee
LEI RYAN
0 granted patents·3 pending applications·0 citations·filing 2004–2005
Top patents by PatentIndex Score
3 records- 0146US2006046488A1Germanium-on-insulator fabrication utilizing wafer bondingLEI RYAN·Filed 2005·Application pending·0 cites
- 0246US2006049399A1Germanium-on-insulator fabrication utilizing wafer bondingLEI RYAN·Filed 2005·Application pending·0 cites
- 0339US2005211982A1Strained silicon with reduced roughnessLEI RYAN·Filed 2004·Application pending·0 cites
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