Assignee
LEI WEI-SHENG
US33 patents
Top patents by PatentIndex Score
US8642448B2Feb 4, 2014
Wafer dicing using femtosecond-based laser and plasma etch
LEI WEI-SHENG23 citations96
US9076860B1Jul 7, 2015
Residue removal from singulated die sidewall
LEI WEI-SHENG49 citations94
US8975163B1Mar 10, 2015
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
LEI WEI-SHENG43 citations94
US9224650B2Dec 29, 2015
Wafer dicing from wafer backside and front side
LEI WEI-SHENG23 citations93
US9018079B1Apr 28, 2015
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
LEI WEI-SHENG26 citations93
US8912075B1Dec 16, 2014
Wafer edge warp supression for thin wafer supported by tape frame
LEI WEI-SHENG25 citations93
US8507363B2Aug 13, 2013
Laser and plasma etch wafer dicing using water-soluble die attach film
LEI WEI-SHENG24 citations92
US9601375B2Mar 21, 2017
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
LEI WEI-SHENG9 citations84
US9355907B1May 31, 2016
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
LEI WEI-SHENG14 citations84
US9349648B2May 24, 2016
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
LEI WEI-SHENG7 citations84
US9159624B1Oct 13, 2015
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
LEI WEI-SHENG9 citations84
US9093518B1Jul 28, 2015
Singulation of wafers having wafer-level underfill
LEI WEI-SHENG16 citations84
US9041198B2May 26, 2015
Maskless hybrid laser scribing and plasma etching wafer dicing process
LEI WEI-SHENG6 citations84
US9012305B1Apr 21, 2015
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
LEI WEI-SHENG12 citations84
US8932939B1Jan 13, 2015
Water soluble mask formation by dry film lamination
LEI WEI-SHENG7 citations84
US8927393B1Jan 6, 2015
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
LEI WEI-SHENG5 citations84
US8912078B1Dec 16, 2014
Dicing wafers having solder bumps on wafer backside
LEI WEI-SHENG13 citations84
US8703581B2Apr 22, 2014
Water soluble mask for substrate dicing by laser and plasma etch
LEI WEI-SHENG13 citations84
US8557683B2Oct 15, 2013
Multi-step and asymmetrically shaped laser beam scribing
LEI WEI-SHENG6 citations84
US9460966B2Oct 4, 2016
Method and apparatus for dicing wafers having thick passivation polymer layer
LEI WEI-SHENG3 citations73
US9330977B1May 3, 2016
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
LEI WEI-SHENG4 citations73
US9263308B2Feb 16, 2016
Water soluble mask for substrate dicing by laser and plasma etch
LEI WEI-SHENG3 citations73
US9159621B1Oct 13, 2015
Dicing tape protection for wafer dicing using laser scribe process
LEI WEI-SHENG5 citations73
US9112050B1Aug 18, 2015
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
LEI WEI-SHENG6 citations73
US8951819B2Feb 10, 2015
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
LEI WEI-SHENG6 citations73
US8859397B2Oct 14, 2014
Method of coating water soluble mask for laser scribing and plasma etch
LEI WEI-SHENG4 citations73
US9275902B2Mar 1, 2016
Dicing processes for thin wafers with bumps on wafer backside
LEI WEI-SHENG2 citations63
US9129904B2Sep 8, 2015
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
LEI WEI-SHENG3 citations63
US8940619B2Jan 27, 2015
Method of diced wafer transportation
LEI WEI-SHENG3 citations63
US9443765B2Sep 13, 2016
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
LEI WEI-SHENG1 citations52
US9299611B2Mar 29, 2016
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
LEI WEI-SHENG1 citations52
US9209084B2Dec 8, 2015
Maskless hybrid laser scribing and plasma etching wafer dicing process
LEI WEI-SHENG1 citations52
US9126285B2Sep 8, 2015
Laser and plasma etch wafer dicing using physically-removable mask
LEI WEI-SHENG0 citations42