Assignee
LEI YI-YANG
TW·3 granted patents·8 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0174US8501613B2UBM etching methods for eliminating undercutLEI YI-YANG·Filed 2011·Granted Aug 6, 2013·4 cites·12 claims
- 0274US8389397B2Method for reducing UBM undercut in metal bump structuresLEI YI-YANG·Filed 2010·Granted Mar 5, 2013·4 cites·19 claims
- 0343US8748306B2Cleaning residual molding compound on solder bumpsLEI YI-YANG·Filed 2011·Granted Jun 10, 2014·0 cites·11 claims
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