Assignee
LETERTRE FABRICE
FR·13 granted patents·2 pending applications·25 citations·filing 2006–2012
Top patents by PatentIndex Score
15 records- 0192US8114754B2Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methodsLETERTRE FABRICE·Filed 2010·Granted Feb 14, 2012·11 cites·16 claims
- 0280US8507361B2Fabrication of substrates with a useful layer of monocrystalline semiconductor materialLETERTRE FABRICE·Filed 2011·Granted Aug 13, 2013·4 cites·23 claims
- 0375US8093687B2Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transferLETERTRE FABRICE·Filed 2008·Granted Jan 10, 2012·3 cites·21 claims
- 0473US8951887B2Process for fabricating a semiconductor structure employing a temporary bondLETERTRE FABRICE·Filed 2012·Granted Feb 10, 2015·3 cites·16 claims
- 0571US8541290B2Optoelectronic substrate and methods of making sameLETERTRE FABRICE·Filed 2011·Granted Sep 24, 2013·2 cites·17 claims
- 0663US8486771B2Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including sameLETERTRE FABRICE·Filed 2009·Granted Jul 16, 2013·1 cites·25 claims
- 0763US8252664B2Fabrication of substrates with a useful layer of monocrystalline semiconductor materialLETERTRE FABRICE·Filed 2011·Granted Aug 28, 2012·1 cites·15 claims
- 0856US2011143522A1Relaxation of strained layersLETERTRE FABRICE·Filed 2009·Application pending·0 cites
- 0953US8487295B2Semiconductor structures and devices including semiconductor material on a non-glassy bonding layerLETERTRE FABRICE·Filed 2012·Granted Jul 16, 2013·0 cites·14 claims
- 1052US10002763B2Fabrication of substrates with a useful layer of monocrystalline semiconductor materialLETERTRE FABRICE·Filed 2011·Granted Jun 19, 2018·0 cites·21 claims
- 1152US8461014B2Methods of fabricating semiconductor structures and devices with strained semiconductor materialLETERTRE FABRICE·Filed 2012·Granted Jun 11, 2013·0 cites·20 claims
- 1251US8481408B2Relaxation of strained layersLETERTRE FABRICE·Filed 2012·Granted Jul 9, 2013·0 cites·22 claims
- 1347US8679942B2Strain engineered composite semiconductor substrates and methods of forming sameLETERTRE FABRICE·Filed 2009·Granted Mar 25, 2014·0 cites·32 claims
- 1442US2006220129A1Hybrid fully SOI-type multilayer structureLETERTRE FABRICE·Filed 2006·Application pending·0 cites
- 1541US9041165B2Relaxation and transfer of strained material layersLETERTRE FABRICE·Filed 2010·Granted May 26, 2015·0 cites·15 claims
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