Assignee
LEUNG CHI KUEN VINCENT
HK·2 granted patents·43 citations·filing 2009–2010
Top patents by PatentIndex Score
2 records- 0191US8194411B2Electronic package with stacked modules with channels passing through metal layers of the modulesLEUNG CHI KUEN VINCENT·Filed 2009·Granted Jun 5, 2012·43 cites·11 claims
- 0238US8544165B2Apparatus for aligning electronic componentsLEUNG CHI KUEN VINCENT·Filed 2010·Granted Oct 1, 2013·0 cites·10 claims
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