Assignee
LI FELIX C
US·2 granted patents·18 citations·filing 2008–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0185US8097934B1Delamination resistant device package having low moisture sensitivityLI FELIX C·Filed 2008·Granted Jan 17, 2012·16 cites·42 claims
- 0265US8736042B2Delamination resistant device package having raised bond surface and mold locking apertureLI FELIX C·Filed 2011·Granted May 27, 2014·2 cites·15 claims
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