Assignee
LI TUNG LOK
CN·4 granted patents·1 pending application·127 citations·filing 2007–2011
Top patents by PatentIndex Score
5 records- 0196US8072053B2Leadless integrated circuit package having electrically routed contactsLI TUNG LOK·Filed 2009·Granted Dec 6, 2011·121 cites·21 claims
- 0274US8497159B2Method of manufacturing leadless integrated circuit packages having electrically routed contactsLI TUNG LOK·Filed 2011·Granted Jul 30, 2013·3 cites·9 claims
- 0364US9806006B2Etch isolation LPCC/QFN stripLI TUNG LOK·Filed 2007·Granted Oct 31, 2017·3 cites·20 claims
- 0448US8124462B2Enhanced integrated circuit packageLI TUNG LOK·Filed 2011·Granted Feb 28, 2012·0 cites·9 claims
- 0535US2010314728A1Ic package having an inductor etched into a leadframe thereofLI TUNG LOK·Filed 2010·Application pending·0 cites
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