Assignee
LI YUZHUO
DE·4 granted patents·8 pending applications·3 citations·filing 2005–2012
Top patents by PatentIndex Score
12 records- 0162US8597539B2Chemical mechanical polishing (CMP) polishing solution with enhanced performanceLI YUZHUO·Filed 2009·Granted Dec 3, 2013·2 cites·20 claims
- 0257US8684793B2Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarizationLI YUZHUO·Filed 2010·Granted Apr 1, 2014·1 cites·20 claims
- 0349US2009321390A1Chemical mechanical polishing of moisture sensitive surfaces and compositions thereofLI YUZHUO·Filed 2007·Application pending·0 cites
- 0449US2010059390A1METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SUBSTRATESLI YUZHUO·Filed 2007·Application pending·0 cites
- 0545US2007037491A1Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishingLI YUZHUO·Filed 2005·Application pending·0 cites
- 0643US9487674B2Chemical mechanical polishing (CMP) composition comprising a glycosideLI YUZHUO·Filed 2012·Granted Nov 8, 2016·0 cites·15 claims
- 0742US2009047787A1Slurry containing multi-oxidizer and nano-abrasives for tungsten CMPLI YUZHUO·Filed 2008·Application pending·0 cites
- 0833US2013171824A1Process for chemically mechanically polishing substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride filmsLI YUZHUO·Filed 2011·Application pending·0 cites
- 0933US2013161285A1Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devicesLI YUZHUO·Filed 2011·Application pending·0 cites
- 1033US2013168348A1Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon filmsLI YUZHUO·Filed 2011·Application pending·0 cites
- 1133US2013200038A1Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devicesLI YUZHUO·Filed 2011·Application pending·0 cites
- 1231US9496146B2Method for forming through-base wafer viasLI YUZHUO·Filed 2012·Granted Nov 15, 2016·0 cites·20 claims
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