Assignee
LIAO KUO-HSIEN
TW·7 granted patents·197 citations·filing 2007–2011
Top patents by PatentIndex Score
7 records- 0196US8247889B2Package having an inner shield and method for making the sameLIAO KUO-HSIEN·Filed 2010·Granted Aug 21, 2012·31 cites·10 claims
- 0295US8212340B2Chip package and manufacturing method thereofLIAO KUO-HSIEN·Filed 2009·Granted Jul 3, 2012·41 cites·20 claims
- 0394US8212339B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2010·Granted Jul 3, 2012·28 cites·20 claims
- 0492US9070793B2Semiconductor device packages having electromagnetic interference shielding and related methodsLIAO KUO-HSIEN·Filed 2011·Granted Jun 30, 2015·58 cites·20 claims
- 0591US8653633B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2011·Granted Feb 18, 2014·13 cites·20 claims
- 0689US9007273B2Semiconductor package integrated with conformal shield and antennaLIAO KUO-HSIEN·Filed 2011·Granted Apr 14, 2015·24 cites·17 claims
- 0762US8144479B2Wireless communication moduleLIAO KUO-HSIEN·Filed 2007·Granted Mar 27, 2012·2 cites·7 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →