Assignee
LII MIRNG-JI
TW·3 granted patents·16 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0188US9768105B2Rigid interconnect structures in package-on-package assembliesLII MIRNG-JI·Filed 2012·Granted Sep 19, 2017·12 cites·20 claims
- 0263US8524595B2Semiconductor package structuresLII MIRNG-JI·Filed 2009·Granted Sep 3, 2013·2 cites·20 claims
- 0363US8169076B2Interconnect structures having lead-free solder bumpsLII MIRNG-JI·Filed 2009·Granted May 1, 2012·2 cites·20 claims
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