Assignee
LIM CHEE CHIAN
MY·3 granted patents·2 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0162US8563357B2Method of packaging a dieLIM CHEE CHIAN·Filed 2008·Granted Oct 22, 2013·2 cites·23 claims
- 0246USRE43818EFabrication of an integrated circuit packageLIM CHEE CHIAN·Filed 2011·Granted Nov 20, 2012·0 cites·20 claims
- 0338US8604595B2Multi-chip electronic package with reduced stressLIM CHEE CHIAN·Filed 2008·Granted Dec 10, 2013·0 cites·20 claims
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