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LIM KEN BENG

MY3 patents

Top patents by PatentIndex Score

US8598698B1Dec 3, 2013

Package substrate with an embedded stiffener

LIM KEN BENG17 citations78

US9054077B2Jun 9, 2015

Package having spaced apart heat sink

LIM KEN BENG2 citations57

US9076776B1Jul 7, 2015

Integrated circuit package with stand-off legs

LIM KEN BENG0 citations35