Assignee
LIM SANG-HYUNG
0 granted patents·2 pending applications·0 citations·filing 2009–2012
Top patents by PatentIndex Score
2 records- 0161US2010011925A1Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut therebyLIM SANG-HYUNG·Filed 2009·Application pending·0 cites
- 0254US2013042735A1METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]LIM SANG-HYUNG·Filed 2012·Application pending·0 cites
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