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LIM THIAM B
SG2 patents
Top patents by PatentIndex Score
US5227232AJul 13, 1993
Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
LIM THIAM B80 citations94
US5146312ASep 8, 1992
Insulated lead frame for semiconductor packaged devices
LIM THIAM B9 citations71