Assignee
LIN CHIA-SHENG
TW9 patents
Top patents by PatentIndex Score
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Chip package and fabrication method thereof
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Cable tightening device having anti-theft function
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Chip package and fabrication method thereof
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Electronics device package and fabrication method thereof
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Substrate structure with through vias
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Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereof
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Chip package and method for forming the same
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Electronics device package and fabrication method thereof
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