Assignee
LIN CHIN-SUNG
TW·2 granted patents·1 pending application·1 citations·filing 2006–2012
Top patents by PatentIndex Score
3 records- 0156US8289727B2Package substrateLIN CHIN-SUNG·Filed 2010·Granted Oct 16, 2012·1 cites·15 claims
- 0244US9449909B2Method of forming a package substrateLIN CHIN-SUNG·Filed 2012·Granted Sep 20, 2016·0 cites·20 claims
- 0338US2007194434A1Differential signal transmission structure, wiring board, and chip packageLIN CHIN-SUNG·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →