Assignee
LIN CHUN YING
TW·2 granted patents·0 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0146US8105876B2Leadframe for leadless package, structure and manufacturing method using the sameLIN CHUN YING·Filed 2011·Granted Jan 31, 2012·0 cites·6 claims
- 0246US8106494B2Leadframe for leadless package, structure and manufacturing method using the sameLIN CHUN YING·Filed 2011·Granted Jan 31, 2012·0 cites·8 claims
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