Assignee

LIN CHUN-TE

TW·2 granted patents·3 citations·filing 2007–2008

Technology mixH04L1 H10W1

Top patents by PatentIndex Score

2 records

0159US8531009B2Package structure of three-dimensional stacking dice and method for manufacturing the sameLIN CHUN-TE·Filed 2008·Granted Sep 10, 2013·3 cites·6 claims
0245US8122241B2Method for delivering a confidential e-mailLIN CHUN-TE·Filed 2007·Granted Feb 21, 2012·0 cites·9 claims

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