Assignee
LIN CHUNG HSIEN
TW·4 granted patents·4 pending applications·18 citations·filing 2008–2018
Top patents by PatentIndex Score
8 records- 0193US8486744B2Multiple bonding in wafer level packagingLIN CHUNG-HSIEN·Filed 2010·Granted Jul 16, 2013·11 cites·20 claims
- 0290US8716051B2MEMS device with release apertureLIN CHUNG-HSIEN·Filed 2010·Granted May 6, 2014·7 cites·18 claims
- 0349US2020070393A1Movable Needle Valve of Hot-Runner MoldLIN CHUNG HSIEN·Filed 2018·Application pending·0 cites
- 0447US2010060580A1Computer mouse with less frictionLIN CHUNG-HSIEN·Filed 2008·Application pending·0 cites
- 0546US2008320196A1Computer system with processor expansion deviceLIN CHUNG-HSIEN·Filed 2008·Application pending·0 cites
- 0641US9623597B2Gate structure of open-chamber hot-runner moldLIN CHUNG-HSIEN·Filed 2015·Granted Apr 18, 2017·0 cites·14 claims
- 0741US8551798B2Microstructure with an enhanced anchorLIN CHUNG-HSIEN·Filed 2010·Granted Oct 8, 2013·0 cites·20 claims
- 0836US2012187983A1Frequency generatorLIN CHUNG-HSIEN·Filed 2011·Application pending·0 cites
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