Assignee
LIN DIANN FANG
TW·4 granted patents·6 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0172US8058102B2Package structure and manufacturing method thereofLIN DIANN-FANG·Filed 2009·Granted Nov 15, 2011·5 cites·7 claims
- 0258US10651146B2Chip packaging structure and manufacturing method for the sameLIN DIANN FANG·Filed 2012·Granted May 12, 2020·1 cites·7 claims
- 0347US8749048B2Package structureLIN DIANN-FANG·Filed 2011·Granted Jun 10, 2014·0 cites·13 claims
- 0439US8962390B2Method for manufacturing a chip packaging structureLIN DIANN-FANG·Filed 2011·Granted Feb 24, 2015·0 cites·7 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →