Assignee
LIN GERALDINE TSUI YEE
HK·2 granted patents·22 citations·filing 2004–2012
Top patents by PatentIndex Score
2 records- 0174US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 0247US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims
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