Assignee
LIN HSIN-CHIANG
TW·8 granted patents·5 pending applications·3 citations·filing 2011–2012
Top patents by PatentIndex Score
13 records- 0165US8476664B2Light emitting diode package having multiple luminescent conversion layersLIN HSIN-CHIANG·Filed 2011·Granted Jul 2, 2013·2 cites·15 claims
- 0260US8735933B2Light emitting diode package and method of manufacturing the sameLIN HSIN-CHIANG·Filed 2012·Granted May 27, 2014·1 cites·4 claims
- 0356US8513695B2LED package and method for making the sameLIN HSIN-CHIANG·Filed 2011·Granted Aug 20, 2013·0 cites·7 claims
- 0456US8492180B2LED and method for manufacturing the sameLIN HSIN-CHIANG·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
- 0552US8633507B2LED with versatile mounting waysLIN HSIN-CHIANG·Filed 2012·Granted Jan 21, 2014·0 cites·17 claims
- 0642US8883533B2Method for manufacturing light emitting diode packageLIN HSIN-CHIANG·Filed 2012·Granted Nov 11, 2014·0 cites·18 claims
- 0742US2013069101A1Method for manufacturing led and led obtained therebyLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 0841US9123870B2LED package structureLIN HSIN-CHIANG·Filed 2011·Granted Sep 1, 2015·0 cites·9 claims
- 0940US8664018B2Manufacturing method for LED packageLIN HSIN-CHIANG·Filed 2011·Granted Mar 4, 2014·0 cites·12 claims
- 1040US2013168709A1Light emitting diode device with multiple light emitting diodesLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 1140US2013065332A1Method for manufacturing led with an encapsulant having a flat top faceLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 1239US2012211786A1Led package structure with a wide optical fieldLIN HSIN-CHIANG·Filed 2011·Application pending·0 cites
- 1338US2012280262A1Semiconductor light emitting device and method for manufacturing thereofLIN HSIN-CHIANG·Filed 2011·Application pending·0 cites
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