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LIN HSIU-JEN

TW2 patents

Top patents by PatentIndex Score

US8440503B1May 14, 2013

Methods for performing reflow in bonding processes

LIN HSIU-JEN13 citations83

US8236687B2Aug 7, 2012

Die-bonding method of LED chip and LED manufactured by the same

LIN HSIU-JEN6 citations82