Assignee

LIN I-CHIA

TW·2 granted patents·39 citations·filing 2012–2012

Technology mixH01L2 H10W2 H01Q1

Top patents by PatentIndex Score

2 records

0189US8704341B2Semiconductor packages with thermal dissipation structures and EMI shieldingLIN I-CHIA·Filed 2012·Granted Apr 22, 2014·25 cites·19 claims
0284US9153542B2Semiconductor package having an antenna and manufacturing method thereofLIN I-CHIA·Filed 2012·Granted Oct 6, 2015·14 cites·17 claims

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