Assignee

LIN KO-WEI

TW·2 granted patents·0 citations·filing 2009–2009

Technology mixH05K2 H10W2 Y02P1

Top patents by PatentIndex Score

2 records

0142US8089164B2Substrate having optional circuits and structure of flip chip bondingLIN KO-WEI·Filed 2009·Granted Jan 3, 2012·0 cites·17 claims
0239US8389869B2Circuit board having pad and chip package structure thereofLIN KO-WEI·Filed 2009·Granted Mar 5, 2013·0 cites·11 claims

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