Assignee
LIN PAUL T
US·3 granted patents·1 pending application·118 citations·filing 1992–2011
Top patents by PatentIndex Score
4 records- 0190US7667338B2Package with solder-filled via holes in molding layersLIN PAUL T·Filed 2007·Granted Feb 23, 2010·21 cites·25 claims
- 0285US7408253B2Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing densityLIN PAUL T·Filed 2005·Granted Aug 5, 2008·14 cites·6 claims
- 0384US5280193ARepairable semiconductor multi-package module having individualized package bodies on a PC board substrateLIN PAUL T·Filed 1992·Granted Jan 18, 1994·83 cites·5 claims
- 0439US2012020040A1Package-to-package stacking by using interposer with traces, and or standoffs and solder ballsLIN PAUL T·Filed 2011·Application pending·0 cites
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