Assignee

LIN PO-YAO

TW2 patents

Top patents by PatentIndex Score

US8970029B2Mar 3, 2015

Thermally enhanced heat spreader for flip chip packaging

LIN PO-YAO17 citations82

US8283777B2Oct 9, 2012

Compressive ring structure for flip chip packaging

LIN PO-YAO3 citations61