Assignee
LIN QINGHUANG
US·22 granted patents·2 pending applications·88 citations·filing 2007–2012
Top patents by PatentIndex Score
24 records- 0195US8900988B2Method for forming self-aligned airgap interconnect structuresLIN QINGHUANG·Filed 2011·Granted Dec 2, 2014·18 cites·11 claims
- 0292US8202783B2Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabricationLIN QINGHUANG·Filed 2009·Granted Jun 19, 2012·9 cites·16 claims
- 0391US8461039B2Patternable low-K dielectric interconnect structure with a graded cap layer and method of fabricationLIN QINGHUANG·Filed 2012·Granted Jun 11, 2013·5 cites·18 claims
- 0489US8659115B2Airgap-containing interconnect structure with improved patternable low-K material and method of fabricatingLIN QINGHUANG·Filed 2009·Granted Feb 25, 2014·10 cites·23 claims
- 0586US8822137B2Self-aligned fine pitch permanent on-chip interconnect structures and method of fabricationLIN QINGHUANG·Filed 2011·Granted Sep 2, 2014·7 cites·17 claims
- 0685US9196523B2Self-aligned permanent on-chip interconnect structuresLIN QINGHUANG·Filed 2012·Granted Nov 24, 2015·6 cites·13 claims
- 0782US8890318B2Middle of line structuresLIN QINGHUANG·Filed 2011·Granted Nov 18, 2014·4 cites·10 claims
- 0882US8795556B2Self-aligned permanent on-chip interconnect structure formed by pitch splittingLIN QINGHUANG·Filed 2012·Granted Aug 5, 2014·4 cites·19 claims
- 0982US8084862B2Interconnect structures with patternable low-k dielectrics and method of fabricating sameLIN QINGHUANG·Filed 2007·Granted Dec 27, 2011·6 cites·6 claims
- 1078US8232198B2Self-aligned permanent on-chip interconnect structure formed by pitch splittingLIN QINGHUANG·Filed 2010·Granted Jul 31, 2012·3 cites·16 claims
- 1174US9431295B2Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating sameLIN QINGHUANG·Filed 2012·Granted Aug 30, 2016·2 cites·20 claims
- 1273US9087753B2Printed transistor and fabrication methodLIN QINGHUANG·Filed 2012·Granted Jul 21, 2015·2 cites·13 claims
- 1372US9484248B2Patternable dielectric film structure with improved lithography and method of fabricating sameLIN QINGHUANG·Filed 2011·Granted Nov 1, 2016·2 cites·13 claims
- 1472US8450854B2Interconnect structures with patternable low-k dielectrics and method of fabricating sameLIN QINGHUANG·Filed 2010·Granted May 28, 2013·2 cites·17 claims
- 1570US8476758B2Airgap-containing interconnect structure with patternable low-k material and method of fabricatingLIN QINGHUANG·Filed 2008·Granted Jul 2, 2013·3 cites·20 claims
- 1670US8445377B2Mechanically robust metal/low-k interconnectsLIN QINGHUANG·Filed 2011·Granted May 21, 2013·2 cites·20 claims
- 1766US8334203B2Interconnect structure and method of fabricatingLIN QINGHUANG·Filed 2010·Granted Dec 18, 2012·1 cites·10 claims
- 1864US8163658B2Multiple patterning using improved patternable low-k dielectric materialsLIN QINGHUANG·Filed 2009·Granted Apr 24, 2012·1 cites·17 claims
- 1963US9209126B2Self-aligned fine pitch permanent on-chip interconnect structures and method of fabricationLIN QINGHUANG·Filed 2012·Granted Dec 8, 2015·1 cites·9 claims
- 2055US8916978B2Interconnect structure and method of fabricatingLIN QINGHUANG·Filed 2012·Granted Dec 23, 2014·0 cites·16 claims
- 2155US8618663B2Patternable dielectric film structure with improved lithography and method of fabricating sameLIN QINGHUANG·Filed 2007·Granted Dec 31, 2013·0 cites·17 claims
- 2251US2012228775A1Airgap-containing interconnect structure with patternable low-k material and method of fabricatingLIN QINGHUANG·Filed 2012·Application pending·0 cites
- 2350US8487411B2Multiple patterning using improved patternable low-κ dielectric materialsLIN QINGHUANG·Filed 2012·Granted Jul 16, 2013·0 cites·20 claims
- 2449US2013062732A1Interconnect structures with functional components and methods for fabricationLIN QINGHUANG·Filed 2011·Application pending·0 cites
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