Assignee
LIN SEAN X
US·2 granted patents·16 citations·filing 2012–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0189US8517769B1Methods of forming copper-based conductive structures on an integrated circuit deviceLIN SEAN X·Filed 2012·Granted Aug 27, 2013·14 cites·41 claims
- 0264US8673766B2Methods of forming copper-based conductive structures by forming a copper-based seed layer having an as-deposited thickness profile and thereafter performing an etching process and electroless copper depositionLIN SEAN X·Filed 2012·Granted Mar 18, 2014·2 cites·18 claims
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