Assignee
LIN TSUNG-SHU
TW·4 granted patents·13 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0188US9978656B2Mechanisms for forming fine-pitch copper bump structuresLIN TSUNG SHU·Filed 2012·Granted May 22, 2018·12 cites·20 claims
- 0259US8519535B2Method and structure for controlling package warpageLIN TSUNG-SHU·Filed 2011·Granted Aug 27, 2013·1 cites·13 claims
- 0340US9548283B2Package redistribution layer structure and method of forming sameLIN TSUNG-SHU·Filed 2012·Granted Jan 17, 2017·0 cites·22 claims
- 0438US8927333B2Die carrier for package on package assemblyLIN TSUNG-SHU·Filed 2011·Granted Jan 6, 2015·0 cites·8 claims
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