Assignee
LIN WEN-YI
5 patents
Top patents by PatentIndex Score
US7766260B2Aug 3, 2010
Showerhead
LIN WEN-YI22 citations92
US8462510B2Jun 11, 2013
Board-level package with tuned mass damping structure
LIN WEN-YI7 citations84
US8779582B2Jul 15, 2014
Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas
LIN WEN-YI5 citations73
US8976529B2Mar 10, 2015
Lid design for reliability enhancement in flip chip package
LIN WEN-YI4 citations72
US8946888B2Feb 3, 2015
Package on packaging structure and methods of making same
LIN WEN-YI0 citations51