Assignee
LIN YU-YU
TW·2 granted patents·2 pending applications·57 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0195US8134139B2Programmable metallization cell with ion buffer layerLIN YU-YU·Filed 2010·Granted Mar 13, 2012·46 cites·31 claims
- 0288US9053949B2Semiconductor device and associated method with heat spreader having protrusionLIN YU-YU·Filed 2012·Granted Jun 9, 2015·11 cites·13 claims
- 0335US2012032328A1Package structure with underfilling material and packaging method thereofLIN YU-YU·Filed 2010·Application pending·0 cites
- 0435US2012018884A1Semiconductor package structure and forming method thereofLIN YU-YU·Filed 2010·Application pending·0 cites
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