Assignee
LIN YUNG-CHI
TW·8 granted patents·437 citations·filing 1989–2021
Top patents by PatentIndex Score
8 records- 0198US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 0297US8866301B2Package systems having interposers with interconnection structuresLIN YUNG-CHI·Filed 2010·Granted Oct 21, 2014·33 cites·21 claims
- 0382US8772945B2Through silicon via with embedded barrier padLIN YUNG-CHI·Filed 2012·Granted Jul 8, 2014·6 cites·20 claims
- 0478US9112007B2Through via structure and methodLIN YUNG-CHI·Filed 2012·Granted Aug 18, 2015·3 cites·13 claims
- 0574US8405201B2Through-silicon via structureLIN YUNG-CHI·Filed 2010·Granted Mar 26, 2013·3 cites·20 claims
- 0663US8791011B2Through-silicon via structure formation processLIN YUNG-CHI·Filed 2013·Granted Jul 29, 2014·1 cites·23 claims
- 0759US12179044B2Positive-pressure protective wearLIN YUNG CHI·Filed 2021·Granted Dec 31, 2024·0 cites·7 claims
- 0839US5022533AMoving display rackLIN YUNG CHI·Filed 1989·Granted Jun 11, 1991·10 cites·4 claims
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