Assignee
LINDSEY JR PAUL C
US·5 granted patents·74 citations·filing 2005–2017
Top patents by PatentIndex Score
5 records- 0194US8450188B1Method of removing back metal from an etched semiconductor scribe streetLINDSEY JR PAUL C·Filed 2011·Granted May 28, 2013·24 cites·17 claims
- 0289US8906745B1Method using fluid pressure to remove back metal from semiconductor wafer scribe streetsLINDSEY JR PAUL C·Filed 2014·Granted Dec 9, 2014·21 cites·20 claims
- 0387US8220685B1System for breaking a semiconductor wafer or other workpiece along a scribe lineLINDSEY JR PAUL C·Filed 2005·Granted Jul 17, 2012·25 cites·13 claims
- 0476US8445361B1Method of dividing a semiconductor wafer having semiconductor and metal layers into separate devicesLINDSEY JR PAUL C·Filed 2011·Granted May 21, 2013·4 cites·7 claims
- 0542US10056297B1Modified plasma dicing process to improve back metal cleavingLINDSEY JR PAUL C·Filed 2017·Granted Aug 21, 2018·0 cites·9 claims
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