Assignee
LINTEC CORP
JP522 patents
Top patents by PatentIndex Score
US6176966B1Jan 23, 2001
Method of die bonding electronic component and die bonding apparatus thereof
LINTEC CORP110 citations98
US5110388AMay 5, 1992
Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
LINTEC CORP150 citations98
US6773778B2Aug 10, 2004
Hard coat film
LINTEC CORP76 citations97
US6544371B2Apr 8, 2003
Method of using a transfer tape
LINTEC CORP101 citations97
US6398892B1Jun 4, 2002
Method of using pressure sensitive adhesive double coated sheet
LINTEC CORP91 citations97
US5858521AJan 12, 1999
Vibration damper material comprising a vicso elastic layer of unvulcanized rubber
LINTEC CORP188 citations97
US5589192ADec 31, 1996
Gel pharmaceutical formulation for local anesthesia
LINTEC CORP138 citations97
US6558975B2May 6, 2003
Process for producing semiconductor device
LINTEC CORP73 citations96
US6465330B1Oct 15, 2002
Method for grinding a wafer back
LINTEC CORP64 citations96
US6277481B1Aug 21, 2001
Adhesive composition and adhesive sheet
LINTEC CORP74 citations96
US6258198B1Jul 10, 2001
Method and apparatus for applying a protecting film to a semiconductor wafer
LINTEC CORP44 citations96
US6238515B1May 29, 2001
Wafer transfer apparatus
LINTEC CORP68 citations96
US6020408AFeb 1, 2000
Composition for pressure-sensitive adhesive and pressure-sensitive adhesive sheet using pressure-sensitive adhesive formed of the composition
LINTEC CORP58 citations96
US5961768AOct 5, 1999
Apparatus for applying adhesive sheets
LINTEC CORP61 citations96
US5413794AMay 9, 1995
Percutaneous absorption promoter, a tape plaster and a method of promoting percutaneous absorpton
LINTEC CORP42 citations96
US6627037B1Sep 30, 2003
Method of detaching article fixed through pressure sensitive adhesive double coated sheet
LINTEC CORP74 citations95
US6286969B1Sep 11, 2001
Lighting apparatus
LINTEC CORP44 citations95
US5976691ANov 2, 1999
Process for producing chip and pressure sensitive adhesive sheet for said process
LINTEC CORP42 citations95
US5923020AJul 13, 1999
Lighting apparatus
LINTEC CORP60 citations95
US5705016AJan 6, 1998
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP98 citations95
US5695867ADec 9, 1997
Reinforcing and vibration-damping material
LINTEC CORP96 citations95
US5356949AOct 18, 1994
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
LINTEC CORP75 citations95
US5187007AFeb 16, 1993
Adhesive sheets
LINTEC CORP80 citations95
US5118567AJun 2, 1992
Adhesive tape and use thereof
LINTEC CORP100 citations95
US6074729AJun 13, 2000
Pressure-sensitive adhesive sheet
LINTEC CORP62 citations94
US5998013ADec 7, 1999
Anti-glare hard coat film and process for producing the film
LINTEC CORP60 citations94
US5853876ADec 29, 1998
Biodegradable adhesive tape and biodegradable adhesive label
LINTEC CORP44 citations94
US5712038AJan 27, 1998
Vibration damper material
LINTEC CORP82 citations94
US5658646AAug 19, 1997
Biodegradable adhesive tape and biodegradable adhesive label
LINTEC CORP44 citations94
US5164416ANov 17, 1992
Transdermal therapeutic formulation containing a limonene
LINTEC CORP59 citations94
US6977024B2Dec 20, 2005
Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
LINTEC CORP23 citations93
US6753614B2Jun 22, 2004
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, and semiconductor chip packaging body
LINTEC CORP23 citations93
US6736918B1May 18, 2004
Process for producing cards
LINTEC CORP36 citations93
US6098685AAug 8, 2000
Tape application device
LINTEC CORP21 citations93
US5888606AMar 30, 1999
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP49 citations93
US7798195B2Sep 21, 2010
Suction unit
LINTEC CORP20 citations92
US7727615B2Jun 1, 2010
Pressure-sensitive adhesive sheet
LINTEC CORP48 citations92
US7438631B2Oct 21, 2008
Surface-protecting sheet and semiconductor wafer lapping method
LINTEC CORP33 citations92
US7434739B2Oct 14, 2008
Antenna circuit, IC inlet, IC tag, and IC card, as well as manufacturing method of IC tag and manufacturing method of IC card
LINTEC CORP28 citations92
US7135358B2Nov 14, 2006
Process for producing resin-sealed type electronic device
LINTEC CORP23 citations92
US6919262B2Jul 19, 2005
Process for producing semiconductor chips
LINTEC CORP38 citations92
US6878441B2Apr 12, 2005
Pressure sensitive adhesive sheet
LINTEC CORP17 citations92
US6787236B2Sep 7, 2004
Hard coat film
LINTEC CORP35 citations92
US6765289B2Jul 20, 2004
Reinforcement material for silicon wafer and process for producing IC chip using said material
LINTEC CORP27 citations92
US6749898B2Jun 15, 2004
Process film for use in producing ceramic green sheet and method for producing the film
LINTEC CORP23 citations92
US6720375B2Apr 13, 2004
Adhesive composition and adhesive optical component using the composition
LINTEC CORP19 citations92
US6718223B1Apr 6, 2004
Method of processing semiconductor wafer and semiconductor wafer supporting member
LINTEC CORP22 citations92
US6702910B2Mar 9, 2004
Process for producing a chip
LINTEC CORP36 citations92
US6689245B2Feb 10, 2004
Die bonding sheet sticking apparatus and method of sticking die bonding sheet
LINTEC CORP45 citations92
US6656819B1Dec 2, 2003
Process for producing semiconductor device
LINTEC CORP42 citations92
Showing the top 50 of 522 patents by PatentIndex Score.