Assignee
LINTEC CORP
JP·522 granted patents·336 pending applications·6,135 citations·filing 1989–2025
Top patents by PatentIndex Score
858 records- 0196US7727615B2Pressure-sensitive adhesive sheetLINTEC CORP·Filed 2005·Granted Jun 1, 2010·48 cites·3 claims
- 0296US6773778B2Hard coat filmLINTEC CORP·Filed 2001·Granted Aug 10, 2004·76 cites·10 claims
- 0395US5858521AVibration damper material comprising a vicso elastic layer of unvulcanized rubberLINTEC CORP·Filed 1995·Granted Jan 12, 1999·188 cites·3 claims
- 0494US6544371B2Method of using a transfer tapeLINTEC CORP·Filed 2001·Granted Apr 8, 2003·101 cites·2 claims
- 0594US5589192AGel pharmaceutical formulation for local anesthesiaLINTEC CORP·Filed 1994·Granted Dec 31, 1996·138 cites·25 claims
- 0694US5266447APhotochromic compositionLINTEC CORP·Filed 1991·Granted Nov 30, 1993·47 cites·8 claims
- 0793US11541607B2Dielectric-heating bonding film and bonding method using dielectric-heating bonding filmLINTEC CORP·Filed 2017·Granted Jan 3, 2023·2 cites·5 claims
- 0893US7799157B2Pressure-sensitive adhesive sheet and method of manufacturing the sameLINTEC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·4 claims
- 0993US6627037B1Method of detaching article fixed through pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 2000·Granted Sep 30, 2003·74 cites·3 claims
- 1093US5118567AAdhesive tape and use thereofLINTEC CORP·Filed 1989·Granted Jun 2, 1992·100 cites·4 claims
- 1193US5110388AMethod of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tapeLINTEC CORP·Filed 1991·Granted May 5, 1992·150 cites·8 claims
- 1292US11467323B2Laminate and light diffusion control filmLINTEC CORP·Filed 2021·Granted Oct 11, 2022·3 cites·8 claims
- 1392US10273387B2Adhesive sheetLINTEC CORP·Filed 2015·Granted Apr 30, 2019·3 cites·20 claims
- 1492US10233361B2Adhesive sheetLINTEC CORP·Filed 2015·Granted Mar 19, 2019·2 cites·14 claims
- 1592US9431593B2Thermoelectric conversion material and production method thereforLINTEC CORP·Filed 2014·Granted Aug 30, 2016·11 cites·18 claims
- 1692US7431985B2Medical pressure-sensitive adhesive composition, process for producing the same, and medical tapeLINTEC CORP·Filed 2006·Granted Oct 7, 2008·14 cites·6 claims
- 1792US6919262B2Process for producing semiconductor chipsLINTEC CORP·Filed 2002·Granted Jul 19, 2005·38 cites·1 claims
- 1892US5695867AReinforcing and vibration-damping materialLINTEC CORP·Filed 1995·Granted Dec 9, 1997·96 cites·14 claims
- 1991US11479695B2Peel-off detection labelLINTEC CORP·Filed 2019·Granted Oct 25, 2022·4 cites·14 claims
- 2091US10233360B2Adhesive sheetLINTEC CORP·Filed 2015·Granted Mar 19, 2019·3 cites·20 claims
- 2191US10221338B2Adhesive sheetLINTEC CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 2291US7798195B2Suction unitLINTEC CORP·Filed 2005·Granted Sep 21, 2010·20 cites·5 claims
- 2391US7434739B2Antenna circuit, IC inlet, IC tag, and IC card, as well as manufacturing method of IC tag and manufacturing method of IC cardLINTEC CORP·Filed 2006·Granted Oct 14, 2008·28 cites·9 claims
- 2491US7351645B2Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chipLINTEC CORP·Filed 2005·Granted Apr 1, 2008·18 cites·6 claims
- 2591US6558975B2Process for producing semiconductor deviceLINTEC CORP·Filed 2001·Granted May 6, 2003·73 cites·6 claims
- 2691US6020408AComposition for pressure-sensitive adhesive and pressure-sensitive adhesive sheet using pressure-sensitive adhesive formed of the compositionLINTEC CORP·Filed 1998·Granted Feb 1, 2000·58 cites·48 claims
- 2790US11542415B2High-frequency dielectric heating adhesive sheet, and adhesion method in which same is usedLINTEC CORP·Filed 2018·Granted Jan 3, 2023·2 cites·8 claims
- 2890US10619077B2Adhesive sheetLINTEC CORP·Filed 2015·Granted Apr 14, 2020·2 cites·14 claims
- 2990US7935574B2Marking method and sheet for both protective film forming and dicingLINTEC CORP·Filed 2005·Granted May 3, 2011·32 cites·12 claims
- 3090US6258198B1Method and apparatus for applying a protecting film to a semiconductor waferLINTEC CORP·Filed 2000·Granted Jul 10, 2001·44 cites·9 claims
- 3190US6176966B1Method of die bonding electronic component and die bonding apparatus thereofLINTEC CORP·Filed 1998·Granted Jan 23, 2001·110 cites·14 claims
- 3290US5712038AVibration damper materialLINTEC CORP·Filed 1994·Granted Jan 27, 1998·82 cites·14 claims
- 3389US6562428B1Antistatic adhesive sheetLINTEC CORP·Filed 2000·Granted May 13, 2003·42 cites·18 claims
- 3488US10221339B2Adhesive sheet and method for producing sameLINTEC CORP·Filed 2015·Granted Mar 5, 2019·2 cites·10 claims
- 3588US9698370B2Gas barrier film and gas barrier film production methodLINTEC CORP·Filed 2012·Granted Jul 4, 2017·4 cites·6 claims
- 3688US7875144B2Transferring device and transferring methodLINTEC CORP·Filed 2008·Granted Jan 25, 2011·12 cites·10 claims
- 3788US6787236B2Hard coat filmLINTEC CORP·Filed 2002·Granted Sep 7, 2004·35 cites·17 claims
- 3888US5705016AMethod of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheetLINTEC CORP·Filed 1995·Granted Jan 6, 1998·98 cites·2 claims
- 3987US10460973B2Adhesive tape for semiconductor processing and method for producing semiconductor deviceLINTEC CORP·Filed 2017·Granted Oct 29, 2019·7 cites·20 claims
- 4087US9234272B2Gas barrier film and method for producing gas barrier filmLINTEC CORP·Filed 2012·Granted Jan 12, 2016·4 cites·11 claims
- 4187US8038824B2Sheet peeling apparatus and peeling methodLINTEC CORP·Filed 2009·Granted Oct 18, 2011·12 cites·6 claims
- 4287US7611600B2Sticking apparatus and sticking methodLINTEC CORP·Filed 2005·Granted Nov 3, 2009·13 cites·12 claims
- 4387US7569272B2Adhesive composition, adhesive sheet and adhesive optical componentLINTEC CORP·Filed 2005·Granted Aug 4, 2009·5 cites·17 claims
- 4487US6702910B2Process for producing a chipLINTEC CORP·Filed 2001·Granted Mar 9, 2004·36 cites·3 claims
- 4587US6689245B2Die bonding sheet sticking apparatus and method of sticking die bonding sheetLINTEC CORP·Filed 2002·Granted Feb 10, 2004·45 cites·13 claims
- 4687US6398892B1Method of using pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 1999·Granted Jun 4, 2002·91 cites·14 claims
- 4787US5998013AAnti-glare hard coat film and process for producing the filmLINTEC CORP·Filed 1997·Granted Dec 7, 1999·60 cites·20 claims
- 4887US5972453ARemovable film for the windows of motor vehiclesLINTEC CORP·Filed 1997·Granted Oct 26, 1999·96 cites·9 claims
- 4986US11654651B2Sheet, heating element, and heating deviceLINTEC CORP·Filed 2016·Granted May 23, 2023·2 cites·17 claims
- 5086US10854495B2Adhesive tape for semiconductor processing, and semiconductor device manufacturing methodLINTEC CORP·Filed 2017·Granted Dec 1, 2020·4 cites·11 claims
Showing the top 50 of 858 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when LINTEC CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →