Assignee
LIU HUNG-YI
TW·3 granted patents·18 citations·filing 2009–2010
Top patents by PatentIndex Score
3 records- 0189US8307321B2Method for dummy metal and dummy via insertionLIU HUNG-YI·Filed 2010·Granted Nov 6, 2012·15 cites·18 claims
- 0268US8504965B2Method for non-shrinkable IP integrationLIU HUNG-YI·Filed 2010·Granted Aug 6, 2013·3 cites·20 claims
- 0342US8239802B2Robust method for integration of bump cells in semiconductor device designLIU HUNG-YI·Filed 2009·Granted Aug 7, 2012·0 cites·23 claims
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