Assignee
LIU TSANG-YU
TW·4 granted patents·12 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0187US8575634B2Chip package and method for fabricating the sameLIU TSANG-YU·Filed 2010·Granted Nov 5, 2013·9 cites·21 claims
- 0270US8536671B2Chip packageLIU TSANG-YU·Filed 2011·Granted Sep 17, 2013·3 cites·28 claims
- 0345US8779557B2Chip package and package wafer with a recognition mark, and method for forming the sameLIU TSANG-YU·Filed 2012·Granted Jul 15, 2014·0 cites·20 claims
- 0436US9142486B2Chip package and fabrication method thereofLIU TSANG-YU·Filed 2012·Granted Sep 22, 2015·0 cites·28 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →