Assignee
LIU YU-WEN
TW·3 granted patents·1 pending application·10 citations·filing 2009–2015
Top patents by PatentIndex Score
4 records- 0180US8810025B2Reinforcement structure for flip-chip packagingLIU YU-WEN·Filed 2011·Granted Aug 19, 2014·6 cites·17 claims
- 0264US9239592B1Docking stationLIU YU-WEN·Filed 2014·Granted Jan 19, 2016·2 cites·12 claims
- 0362US9859235B2Underbump metallization structureLIU YU-WEN·Filed 2009·Granted Jan 2, 2018·2 cites·20 claims
- 0433US2016184638A1Fitness transmission device and information processing methodLIU YU-WEN·Filed 2015·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →