Assignee

LOU BAI-YAO

TW·2 granted patents·10 citations·filing 2011–2012

Technology mixH10W2 H10F1

Top patents by PatentIndex Score

2 records

0179US8207615B2Chip package and method for fabricating the sameLOU BAI-YAO·Filed 2011·Granted Jun 26, 2012·6 cites·20 claims
0275US8742564B2Chip package and method for forming the sameLOU BAI-YAO·Filed 2012·Granted Jun 3, 2014·4 cites·18 claims

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