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LU CHEN-FA
TW5 patents
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US8629053B2Jan 14, 2014
Plasma treatment for semiconductor devices
LU CHEN-FA4 citations72
US8716858B2May 6, 2014
Bump structure with barrier layer on post-passivation interconnect
LU CHEN-FA1 citations51
US8571699B2Oct 29, 2013
System and method to reduce pre-back-grinding process defects
LU CHEN-FA0 citations51
US8636559B2Jan 28, 2014
Method for wafer back-grinding control
LU CHEN-FA0 citations48
US8298041B2Oct 30, 2012
System and method for wafer back-grinding control
LU CHEN-FA0 citations48