Assignee
LU WEN-HSIUNG
TW·8 granted patents·120 citations·filing 2010–2012
Top patents by PatentIndex Score
8 records- 0196US8492891B2Cu pillar bump with electrolytic metal sidewall protectionLU WEN-HSIUNG·Filed 2010·Granted Jul 23, 2013·43 cites·20 claims
- 0295US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 0395US8405199B2Conductive pillar for semiconductor substrate and method of manufactureLU WEN-HSIUNG·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 0488US8581401B2Mechanisms for forming copper pillar bumps using patterned anodesLU WEN-HSIUNG·Filed 2012·Granted Nov 12, 2013·8 cites·20 claims
- 0586US9607921B2Package on package interconnect structureLU WEN-HSIUNG·Filed 2012·Granted Mar 28, 2017·8 cites·17 claims
- 0686US9082776B2Semiconductor package having protective layer with curved surface and method of manufacturing sameLU WEN-HSIUNG·Filed 2012·Granted Jul 14, 2015·7 cites·18 claims
- 0784US8546254B2Mechanisms for forming copper pillar bumps using patterned anodesLU WEN-HSIUNG·Filed 2010·Granted Oct 1, 2013·6 cites·20 claims
- 0852US8809117B2Packaging process tools and packaging methods for semiconductor devicesLU WEN-HSIUNG·Filed 2011·Granted Aug 19, 2014·0 cites·20 claims
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