Assignee

M W GROUP GMBH

DE·1 granted patent·1 citations·filing 2016–2016

Technology mixE04B1 E04F1 E04H1 G03F1 H01L1 H10P1

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0152US10208488B2Processing facility for manufacturing integrated circuits from semiconductor wafers as well as perforated panel for a processing facilityM W GROUP GMBH·Filed 2016·Granted Feb 19, 2019·1 cites·7 claims

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